| 金纳米粒子通过形成Au-S键的组装 |
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| 引用本文： | 胡瑞省,刘善堂,朱涛,刘忠范,黄小华,黄惠忠.金纳米粒子通过形成Au-S键的组装[J].物理化学学报,1999,15(11):961-965. |
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| 作者姓名： | 胡瑞省 刘善堂 朱涛 刘忠范 黄小华 黄惠忠 |
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| 作者单位： | Center for Nanoscale Science and Technology(CNST),College of Chemistry Molecular Engineering,Peking University,Beijing 100871,Institute of Physical Chemistry,College of Chemistry Molecular Engineering,Peking University,Beijing 100871 |
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| 基金项目： | 国家自然科学基金!资助项目(29803002) |
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| 摘 要： | 利用湿化学法以纳米粒子为基本单元构筑各种纳米复合结构，具有灵活简便、通用性强等特点，近年来受到了广泛的重视．Ｎａｔａｎ［１-４］等最先开展了在固体表面上制备金纳米粒子单层膜的研究，他们借助双官能团硅烷化试剂对硅氧化物基底（如玻璃、石英等）进行表面修饰?..
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| 关 键 词： | 金纳米粒子 Au-S键 组装 |
| 收稿时间： | 1999-06-25 |
| 修稿时间： | 1999-07-22 |
Covalent Attachment of Gold Nanoparticles onto the Thiol-terminated Surface through Au-S Bonding |
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| Hu Ruisheng,Liu Shantang,Zhu Tao,Liu Zhongfan,Huang Xiaohua,Huang Huizhong.Covalent Attachment of Gold Nanoparticles onto the Thiol-terminated Surface through Au-S Bonding[J].Acta Physico-Chimica Sinica,1999,15(11):961-965. |
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| Authors: | Hu Ruisheng Liu Shantang Zhu Tao Liu Zhongfan Huang Xiaohua Huang Huizhong |
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| Institution: | Center for Nanoscale Science and Technology(CNST),College of Chemistry Molecular Engineering,Peking University,Beijing 100871|Institute of Physical Chemistry,College of Chemistry Molecular Engineering,Peking University,Beijing 100871 |
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| Abstract: | Gold nanoparticles were covalently attached to the thiol terminated surface,which was created by aqueous silanization of the single crystal silicon substrate with 3 mercaptopropyl trimethyl silane(3 MPTMS).This paper reports the first evidence for Au-S bonding between the gold particles and the surface thiol groups given by the angle resolved XPS measurements. |
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| Keywords: | Gold nanoparticles Au-S bonding Assembly |
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