Electrochemical deposition of copper on steel from a solution of diacido-1,3-propylenediamine-N,N′-diacetato-N,N′-dipropionate cuprate(II)

The possibility of obtaining smooth homogeneous copper coatings with good adhesion and homogeneous copper coatings with poor adhesion by electrochemical deposition of copper on steel from a solution of nontoxic copper(II) complex with the ligands, 1,3-propylenediamine-N,N′-diacetato-N,N′-di-3-propionic acid, was analyzed. For both types of coatings, the optimum composition of the solution and the optimum deposition conditions were determined.