Applications of “Dry” Processing in the Microelectronics Industry Using Carbon Dioxide |
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| Authors: | Charles A Jones Amy Zweber James P DeYoung James B McClain Ruben Carbonell Joseph M DeSimone |
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| Institution: | 1. University of North Carolina at Chapel Hill, Department of Chemistry , Chapel Hill, NC, 27599, USA;2. North Carolina State University, Department of Chemical Engineering , Raleigh, NC, 27695, USA;3. Micell Integrated Systems , Raleigh, NC, 27617, USA |
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| Abstract: | Condensed carbon dioxide (CO2) has emerged as a leading enabler of advanced semiconductor manufacturing processes. By exploiting the physical properties of CO2, some of the current challenges encountered in microelectronics processing related to shrinking feature sizes and materials compatibility have been addressed. Furthermore, the potential for reduction of chemicals used in processing is realized. Applications of CO2 in microelectronics operations such as wafer cleaning, spin-coating, development, and stripping of photoresists, drying, low-k film preparation and repair, etching, and metal deposition are discussed. |
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| Keywords: | supercritical fluids semiconductors cleaning etching photoresist stripping drying low-k metal deposition |
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