Chelating resin containing s-bonded dithizonefor the separation of copper(II), nickel(II) and zinc(II) |
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Authors: | Shah R Devi S |
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Affiliation: | Department of Chemistry, M.S. University, Baroda, 390002, India |
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Abstract: | Analytical and physicochemical properties of a crosslinked poly (vinyl pyridine) based resin containing dithizone were examined. The resin was further used for the preconcentration of copper, nickel and zinc at batch and column level. Various conditions such as pH, equilibration time, temperature were optimised for the maximum loading of copper, nickel and zinc. The loading capacities of the resin for copper, nickel and zinc were observed to be 0.51, 0.59 and 0.65 mmol g−1 of dry resin respectively. Elution of loaded copper, nickel and zinc from the resin was done by using 0.1 M HCl, 0.1 M H2SO4 and 0.1 M HNO3 respectively. Separation of copper, nickel and zinc in binary and ternary mixtures was achieved without any cross contamination. |
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Keywords: | Copper(II) Nickel(II) Zinc(II) Separation s-bonded dithizone |
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