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| 铜电路板缝腐蚀过程缝隙中pH、Cl-浓度分布的测量 | |
| 引用本文： | 张敏,卓向东,林昌健. 铜电路板缝腐蚀过程缝隙中pH、Cl-浓度分布的测量[J]. 电化学, 2008, 14(1): 14-17. DOI: 10.61558/2993-074X.1855 |
| 作者姓名： | 张敏 卓向东 林昌健 |
| 作者单位： | 厦门大学,固体表面物理化学国家重点实验室,化学化工学院,福建,厦门,361005;厦门大学,固体表面物理化学国家重点实验室,化学化工学院,福建,厦门,361005;厦门大学,固体表面物理化学国家重点实验室,化学化工学院,福建,厦门,361005 |
| 摘 要： | 根据铜电路板缝腐蚀特征,研制了阵列式Ag/AgCl、IrO2电极,设计缝隙腐蚀模拟装置,在0.5mol.L-1的NaCl溶液中分别同时原位检测电子线路板缝隙腐蚀过程,缝隙内的氯离子浓度分布、pH分布及其随时间的变化.研究表明,在电子线路板发生缝隙腐蚀的过程中,缝隙内部不同深度的Cl-及H+浓度逐渐增大,且随着与缝口距离的增大而增大,从而导致缝隙腐蚀不断向纵深方向发展. |
| 关 键 词： | 缝隙腐蚀 印刷线路板 阵列电极 Cl- pH |
| 文章编号： | 1006-3471（2008）01-0014-04 |
| 收稿时间： | 2007-11-06 |
| 修稿时间： | 2007-12-06 |
In Situ Measurement of Chloride Concentration and pH Distribution in the Crevice during the Crevice Corrosion of Copper Electronic Board |
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| ZHANG Min,ZHUO Xiang-dong,LIN Chang-jian. In Situ Measurement of Chloride Concentration and pH Distribution in the Crevice during the Crevice Corrosion of Copper Electronic Board[J]. Electrochemistry, 2008, 14(1): 14-17. DOI: 10.61558/2993-074X.1855 | |
| Authors: | ZHANG Min ZHUO Xiang-dong LIN Chang-jian |
| Affiliation: | ZHANG Min,ZHUO Xiang-dong,LIN Chang-jian(State Key Laboratory for Physical Chemistry of Solid Surfaces,Department of Chemistry,Xiamen University,Xiamen 361005,Fujian,China) |
| Abstract: | Although the crevice corrosion of metals had been extensively studied in the past years,it remained lack of direct experimental information of the micro chemical environments and electrochemical conditions inside the corroding crevice.The distribution of chloride concentration and local pH in the occluded area are the most crucial factors in development of crevice corrosion.The array probes in one dimension of Ag/AgCl and IrO2 array were developed in this work to in situ follow the distribution of chloride ... |
| Keywords: | crevice corrosion copper electronic board array electrode chloridion pH |
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