| 微米级铜-银双金属粉镀层结构及其抗氧化性 |
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| 引用本文： | 高保娇,高建峰,蒋红梅,张忠兴.微米级铜-银双金属粉镀层结构及其抗氧化性[J].物理化学学报,2000,16(4):366-369. |
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| 作者姓名： | 高保娇 高建峰 蒋红梅 张忠兴 |
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| 作者单位： | Department of Chemical Engineering,North China Institute of Technology,Taiyuan 030051 |
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| 摘 要： | 微米级铜粉具有许多优良的物理特性与催化活性 ,被广泛用于导电涂料、电极材料、催化剂等领域 但铜粉微细化后 ,由于粒子的比表面很大 ,其化学活性很高［１］,在空气中极易被氧化成氧化亚铜［２］,失去原有的物理化学特性 在铜粉表面镀银形成铜 银双金属粉 ,既能提高铜粉的抗氧化能力 ,又可保持铜粉优良特性［３ ,４］ 我们在铜粉表面镀银的研究中发现 ,当铜粉表面银含量达到一定值后 ,铜 银双金属粉就具备了常温抗氧化能力 ,并不需要铜粉表面完全包覆银 ;而温度升高时 ,表面银含量不同的双金属粉抗氧化温度不同 说明镀银铜粉氧化性与…
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| 关 键 词： | 铜-银双金属粉 表层结构 抗氧化性 |
| 收稿时间： | 1999-06-08 |
| 修稿时间： | 1999-10-03 |
Plating Structure and Antioxygenation of Micron Cu-Ag Bimetallic Powder |
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| Gao Baojiao,Gao Jianfeng,Jiang Hongmei,Zhang Zhongxing.Plating Structure and Antioxygenation of Micron Cu-Ag Bimetallic Powder[J].Acta Physico-Chimica Sinica,2000,16(4):366-369. |
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| Authors: | Gao Baojiao Gao Jianfeng Jiang Hongmei Zhang Zhongxing |
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| Institution: | Department of Chemical Engineering,North China Institute of Technology,Taiyuan 030051 |
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| Abstract: | The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means. It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%, the temperature of oxidation resistance varies with the surface Ag content. The greater the surface Ag content is, the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure. The copper powder plated by silver with full packaging structure can not be oxidized even at 700℃. |
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| Keywords: | Cu-Ag bimetallic power Surface structure Oxidation resistence |
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