Adsorption of Copper (II) Ions onto Surfactant-Modified Oil Palm Leaf Powder |
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| Authors: | M. Rafatullah O. Sulaiman R. Hashim M. H. M. Amini |
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| Affiliation: | 1. Division of Bioresource, Paper and Coatings Technology, School of Industrial Technology, Universiti Sains Malaysia , Penang, Malaysia mohd_rafatullah@yahoo.co.in;4. mrafatullah@usm.my;5. Division of Bioresource, Paper and Coatings Technology, School of Industrial Technology, Universiti Sains Malaysia , Penang, Malaysia |
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| Abstract: | Il palm leaf powder (OPLP), an agricultural solid waste was used as adsorbent for the removal of copper (II) ions after modification with an anionic surfactant, sodium dodecyl benzene sulfonate (SDBS), CH3(CH2)11C6H4SO3Na. The copper (II) ions adsorption is highly dependent on pH and maximum removal was observed at pH 6, above which copper (II) started to precipitate. The equilibrium adsorption data were fitted into the Langmuir and Freundlich isotherms. The Freundlich isotherm model fitted well to data with 0.989 regression coefficient (R2). The kinetics of the adsorption of copper (II) ions onto the surfactant-modified OPLP was best described by a pseudo-second-order model. Comparison of this SDBS-modified-OPLP to previously investigated adsorbents showed comparably good result, offering this material as a promising adsorbent for the treatment of waste waters containing lower concentrations of copper (II) ions. |
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| Keywords: | Adsorption copper (II) kinetic oil palm leaf surfactant |
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