Low percolation conductive graphite flakes-filled poly(urethane-imide) composites with high thermal stability via imidization self-foaming structure

In the study, the conductive graphite flakes filled poly(urethane-imide) composites (PUI/GFs) with high performance were constructed by the thermal imidization self-foaming reaction. It was found that the foaming action could promote the redistribution of GFs during curing process and the formation of stable linear conductive pathways. The percolation threshold of PUI/GFs composites was lowered from 1.26 wt% (2000 mesh GFs) or 0.86 wt% (1000 mesh GFs) to 0.79 wt% (500 mesh GFs), which were relatively low percolation thresholds for polymer/GFs composites so far. When the content of 500 mesh GFs was 4.0 wt%, the electrical conductivity of the composite was as high as 3.96 × 10^?1 S/m. Also, a poly(urethane-imide) (PUI) matrix with excellent thermal stability (T_d10%: 334.97 °C) and mechanical properties (elongation at break: 324.52%, tensile strength: 15.88 MPa) was obtained by introducing the rigid aromatic heterocycle into the polyurethane (PU) hard segments. Moreover, the zero temperature coefficient of resistivity for the composites was observed at the temperature range from 30 °C to 200 °C. Consequently, PUI/GFs composites may provide the novel strategy for considerable conductive materials with high thermal stability in electrical conductivity.