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Improved resistive switching phenomena observed in SiNx‐based resistive switching memory through oxygen doping process
Authors:Ju Hyun Park  Hee‐Dong Kim  Seok Man Hong  Min Ju Yun  Dong Su Jeon  Tae Geun Kim
Institution:School of Electrical Engineering, Korea University, Anam‐dong 5‐ga, Seongbuk‐gu, 136‐701 Seoul, Korea
Abstract:The improvement of resistive switching (RS) phenomena of silicon‐nitride (SiNx)‐based resistive random access memory (ReRAM) cells through oxygen doping process was investigated. As a result, compared to un‐doped SiNx films, the oxygen doped SiNx (SiNx:O2)‐based ReRAM cells show a lower current (~0.3 μA) level at a high resistance state and a smaller variation of operating voltage through the reduction of leakage current in the SiNx:O2 film by combining silicon dangling bonds and doped oxygen ions. Therefore, we believe that the oxygen doping process in SiNx films can effectively improve the RS characteristics of SiNx‐based ReRAM cells. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Keywords:resistive switching  ReRAM  silicon nitride  charge trapping  silicon  dangling bonds
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