Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane |
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Authors: | Wei-Hung Hsu Ching-Hwei Chue |
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Institution: | Department of Mechanical Engineering, National Cheng Kung University, No. 1, Dasyue Road, 70101 Tainan, Taiwan, ROC |
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Abstract: | This paper studies the mode III electro-elastic field of a cracked functionally graded piezoelectric strip bonded to a functionally graded piezoelectric half plane. The crack is oriented in arbitrary direction. The material properties along x-axis vary in exponential form. By using the Fourier transform, the problem can be formulated into a system of singular integral equations and solved by applying the Gauss–Chebyshev integration formula. The effects come from the edge, crack orientation and the nonhomogeneous material parameters on intensity factors are discussed graphically. |
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