射频磁控溅射法制备MoS2薄膜的最佳工艺参数研究(英文)

采用射频(RF)磁控溅射法在石英衬底上制备了MoS₂薄膜。通过正交试验研究了溅射时间、溅射温度、氩气流量和溅射功率对MoS₂薄膜结构的影响。通过XRD、Raman、XPS、EDS和SEM对MoS₂薄膜的结晶度、薄膜厚度和表面形貌进行分析，得到了制备MoS₂薄膜的最佳工艺参数。发现溅射温度较高或较低结晶度都很差，在较低的溅射温度下样品的XRD衍射峰不明显。而当温度为250℃时，样品的XRD衍射峰较多，结晶度较好。根据正交试验法得出溅射温度对MoS₂的结晶效果起着至关重要的作用，其次是氩气流量。当溅射温度为250℃,氩气流量为6 mL/min,溅射时间为30 min,溅射功率为300 W或400 W时，MoS₂膜的结晶度较好。在这个条件下制备的膜较厚，但为以后的实验指明了方向。保持溅射温度、溅射功率和氩气流量不变，通过减少时间成功制备了厚度为58.9 nm的薄膜。

Optimal Process Parameters of Preparing MoS2 Films by RF Magnetron Sputtering

MoS₂ films were prepared on quartz substrate by radio frequency (RF) magnetron sputtering. The effect of sputtering time, sputtering temperature, argon flow rate and sputtering power on the structure of MoS₂ films was studied by orthogonal test method. The crystallinity, thickness and surface morphology of MoS₂ films were analyzed by XRD, Raman, XPS, EDS and SEM, the optimal process parameters for preparing MoS₂ films were obtained. It is found that the crystallinity of the sample is poor at higher or lower sputtering temperature, and the XRD diffraction peak of the sample is not obvious at lower sputtering temperature. When the temperature is 250 ℃, the sample has more XRD diffraction peaks and better crystallinity. According to the orthogonal test, sputtering temperature plays a crucial role in the crystallization of MoS₂, followed by argon flow rate. When sputtering temperature is 250 ℃, argon flow rate is 6 mL/min, sputtering time is 30 min, and sputtering power is 300 W or 400 W, the crystallinity of MoS₂ film is better. The film prepared under this condition is thicker, but it points out the direction for future experiments. In the following experiments, sputtering temperature, sputtering power and argon flow rate can be kept unchanged. By shortening the time, films with a thickness of 58.9 nm have been successfully prepared.