Structural analysis of water adsorbed in silica gel |
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Authors: | Stephen Wallace Larry L. Hench |
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Affiliation: | (1) Advanced Materials Research Center, University of Florida, One Progress Blvd., #14, 32615 Alachua, FL;(2) Present address: Advanced Materials Laboratory, 1001 University Blvd. S.E. - # 100, 87106 Albuquerque, NM |
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Abstract: | The melting point, Tf of water in a pore decreases as the surface area to pore volume ratio of the pore decreases. Analysis of water absorbed in the pores of silica gels using differential scanning calorimetry (DSC) and dielectric relaxation spectroscopy (DRS) shows that the thickness of the bound, non-freezing water layer adjacent to the pore surface increases as its temperature increases, but that it is independent of the surface silanol concentration, [SisOH]. In contrast, the thickness decreases as the cylindrical pore radius rH decreases. Thus, the increase in the bound water thickness from 0.45 nm for gels with rH=1.2 nm to 1.2 nm for gels with rH=7.5 nm is due to the increase from –53°C to –7°C of the temperature (e.g., the melting point Tf) at which the bound water thickness was measured, and not due to the increase in tH or the decrease in [SisOH]. The Tf of bulk water measured in a DSC was –0.3°C. The boiling point Tv of bulk water measured in a DSC was 81.3°C. Tv increased to 94°C in 7.5 nm pores and to 109°C K in 1.2 nm pores. |
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Keywords: | melting point suppression differential scanning calorimeter (DSC) silica gel bound water structure of adsorbed water |
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