| 制备铋靶的脉冲电镀工艺 |
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| 引用本文： | 张红强,戴亚堂,张欢,夏姣.制备铋靶的脉冲电镀工艺[J].强激光与粒子束,2011,23(2). |
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| 作者姓名： | 张红强 戴亚堂 张欢 夏姣 |
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| 作者单位： | 西南科技大学 四川省非金属复合与功能材料重点实验室－省部共建国家重点实验室培育基地, 四川 绵阳 621010 |
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| 基金项目： | 国家高技术发展计划项目，西南科技大学博七基金项目 |
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| 摘 要： | 采用脉冲电镀工艺，以直径为1 mm的铜丝为芯轴，在无氰镀液体系中，制备出惯性约束聚变实验用铋靶所需的金属铋镀层。通过正交试验得到的最佳脉冲工艺条件为：电流密度5 A/cm2，频率600 Hz，占空比1∶6，温度20 ℃。利用扫描探针显微镜和扫描电子显微镜分别对铋镀层表面形貌进行分析，同时利用X射线衍射对铋镀层物相成分进行分析。表征结果表明：所得铋镀层表面细致均匀，孔隙率低，平整性好，无裂纹。
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| 关 键 词： | 铋靶 脉冲电镀 无氰镀液 乙二胺四乙酸盐 表面形貌 |
| 收稿时间： | 1900-01-01; |
Pulse electroplating in bismuth target fabrication |
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| Zhang Hongqiang,Dai Yatang,Zhang Huan,Xia Jiao.Pulse electroplating in bismuth target fabrication[J].High Power Laser and Particle Beams,2011,23(2). |
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| Authors: | Zhang Hongqiang Dai Yatang Zhang Huan Xia Jiao |
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| Institution: | State Key Laboratory Cultivation Base for Nonmetal Composites and Functional Materials, Southwest University of Science and Technology, Mianyang 621010, China |
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| Abstract: | Bismuth plating was obtained on copper substrate by using pulse electroplating in cyanide-free system. The optimal pulse parameters were determined by orthogonal test as follows: current density 5 A/cm2, frequency 600 Hz, duty ratio 1∶6, temperature 20 ℃. Furthermore, scanning electron microscope and scanning probe microscope were used to characterize the morphology of the bismuth plating, and X-ray diffraction was used to analyze the phase components. The bismuth plating has fine and uniform grains, with low porosity, good smoothness and free of cracks. |
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| Keywords: | bismuth target pulse electroplating non-cyanide plating solution versenate surface topography |
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