Transient thermal stresses in fully and partly cooled circular rings

The constraint associated with the direction of the thickness of a thin photoelastic circular-ring model is experimentally proved to occur and it is compared with the theoretical result; the constraint is induced by thermal loads. The method for dealing with the constraint and for obtaining a transient thermal stress under plane-stress conditions is applied to study the thermal stress of the circular ring partly cooled from the inside cylindrical surface. It is found that the thermal stress of the fully cooled circular ring is not always greater than the partly cooled one.