| A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers |
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| 引用本文： | LiNaXU JianHuiLIAO 等.A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers[J].中国化学快报,2002,13(7):687-688. |
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| 作者姓名： | LiNaXU JianHuiLIAO |
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| 作者单位： | [1]DepartmentofChemistryandChemicalEngineering,SoutheastUniversity,Nanjing210096 [2]NationalLaboratoryofMolecularandBiomolecularElectronics,SoutheastUniversity,Nanjing210096 |
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| 基金项目： | This work was supported by the National Natural Science Foundation of China (No.69890220)，Promotional Foundation of Ministry of Education of China for excellent youth teacher (2000)，Open Project Foundation of Laboratory of Solid State Microstruct |
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| 摘 要： | A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.
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| 关 键 词： | 活化方法 非电解金属镀层 钯化学吸附 化学金属镀层 自集合单层 非电解铜镀层 |
A New Activation Method for Electroless Metal Plating: Palladium Laden via Bonding with Self-Assembly Monolayers |
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| Li Na XU,Jian Hui LIAO,Lan HUANG,Dan Lin OU,Kai Chang ZHOU,Hai Qian ZHANG,Ning GU,Ju Zheng LIU.A New Activation Method for Electroless Metal Plating: Palladium Laden via Bonding with Self-Assembly Monolayers[J].Chinese Chemical Letters,2002,13(7):687-688. |
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| Authors: | Li Na XU Jian Hui LIAO Lan HUANG Dan Lin OU Kai Chang ZHOU Hai Qian ZHANG Ning GU Ju Zheng LIU |
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| Abstract: | A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition. A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation. XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs. |
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| Keywords: | Palladium chemisorption amino group SAMs activation electroless plating |
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