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Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic bimaterials under thermal stress
Authors:Yoshiaki Nomura  Toru Ikeda  Noriyuki Miyazaki
Institution:Department of Mechanical Engineering and Science, Kyoto University, Yoshida-Honmachi, Sakyo-ku, Kyoto 606-8501, Japan
Abstract:A numerical method using a path-independent H-integral based on the conservation integral was developed to analyze the singular stress field of a three-dimensional interfacial corner between anisotropic bimaterials under thermal stress. In the present method, the shape of the corner front is smooth. According to the theory of linear elasticity, asymptotic stress near the tip of a sharp interfacial corner is generally singular as a result of a mismatch of the materials’ elastic constants. The eigenvalues and the eigenfunctions are obtained using the Williams eigenfunction method, which depends on the anisotropic materials’ properties and the geometry of an interfacial corner. The order of the singularity related to the eigenvalue is real, complex or power-logarithmic. The amplitudes of the singular stress terms can be calculated using the H-integral. The stress and displacement around an interfacial corner for the H-integral are obtained using finite element analysis. In this study, a proposed definition of the stress intensity factors of an interfacial corner, which includes those of an interfacial crack and a homogeneous crack, is used to evaluate the singular stress fields. Asymptotic solutions of stress and displacement around an interfacial corner front are uniquely obtained using these stress intensity factors. To prove the accuracy of the present method, several different kinds of examples are shown such as interfacial corners or cracks in three-dimensional structures.
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