Thermodynamic properties of liquid Au-Cu-Sn alloys determined from electromotive force measurements

A thermally conductive linear low-density polyethylene (LLDPE) composite with aluminum nitride (AlN) as filler was prepared in a heat press molding. Differential scanning calorimeter results indicated that the AlN filler decreases the degree of crystallinity of LLDPE, and has no obvious influence on the melting temperature of LLDPE. Experimental results demonstrated that the LLDPE composites display a high thermal conductivity of 1.25 W/m K and improved thermal stability at 70 wt% AlN content as compared to pure LLDPE. The dielectric constant and dissipation factor increased with AlN content, however, they still remained at relatively low levels, i.e., <5 in wider frequency range from 10 to 10⁶ Hz. The surface treatment of AlN particles had a beneficial effect on improving the thermal conductivity and dielectric constant, whereas, the dissipation factor was less affected. Additionally, the obtained AlN/LLDPE composites have possessed rather low dielectric constant and high electrical insulation, which is suitable for substrate and packaging materials.