Lead Inclusions in Silicon: Structure, Morphology, and Thermal Behavior

Small inclusions of lead have been embedded in pure silicon by rapid quenching. They are topotactic-truncated octahedra with a smaller aspect ratio than the ones found in aluminum. They appear also on single and multiple twins as a bicrystalline unit with a compound morphology. No overheating has been detected, while undercooling is size dependent and can reach 80 K. These results are compared to the structure, morphology and thermal behavior of lead inclusions in aluminum and other cubic matrices.