首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Novel dinuclear and polynuclear copper(II)-pyrazine-2,3-dicarboxylate supramolecular complexes with 1,3-propanediamine, N,N,N′,N′-tetramethylethylenediamine and 2,2′-bipyridine
Authors:Okan Zafer Ye?ilel  Aylin Mutlu  Orhan Büyükgüngör
Institution:1. Department of Chemistry, Faculty of Arts and Sciences, Eski?ehir Osmangazi University, 26480 Eski?ehir, Turkey;2. Department of Physics, Faculty of Arts and Sciences, Ondokuz May?s University, 55139 Kurupelit, Samsun, Turkey
Abstract:Three novel Cu(II)-pyrazine-2,3-dicarboxylate complexes with 1,3-propanediamine (pen), Cu2(μ-pzdc)2(pen)2] · 2H2O (1), N,N,N,N′-tetramethylethylenediamine (tmen), {Cu(μ-pzdc)(tmen)] · H2O}n(2), and 2,2′-bipyridine (bipy), {Cu(μ-pzdc)(bipy)]·H2O}n(3) have been synthesized and characterized by means of elemental and thermal analyses, magnetic susceptibilities, IR and UV/vis spectroscopic studies. The molecular structures of dinuclear (1) and polynuclear (2 and 3) complexes have been determined by the single crystal X-ray diffraction technique. The pyrazine-2,3-dicarboxylate acts as a bridging ligand through oxygen atom of carboxylate group and N atom of pyrazine ring and one oxygen atom of neighboring carboxylate. It links the Cu(II) ions to generate a distorted square pyramidal geometry forming a one-dimensional (1D) chain. Adjacent chains of 1 and 2 are then mutually linked via hydrogen bonding interactions, which are further assembled to form a two and three-dimensional network, respectively. The chains of complex 3 are further constructed to form three-dimensional framework by hydrogen bonding, C–H?π and ring?ring stacking interactions. In the complexes, Cu(II) ions have distorted square pyramidal geometry. Thermal analyses properties and thermal decomposition mechanism of complexes have been investigated by using thermal analyses techniques (TG, DTG and DTA).
Keywords:Pyrazine-2  3-dicarboxylate Complexes  Coordination polymers  Copper(II) complexes
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号