Mechanical and Thermal Properties and Morphology of Epoxy Resins Modified by a Silicon Compound |
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| Authors: | Songqi Ma Weiqu Liu Zhengjie Wei HONGJING LI |
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| Institution: | 1. Key Laboratory of Polymer Materials for Electronics , Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, China;2. Graduate University of Chinese Academy of Sciences , Beijing, China;3. Key Laboratory of Polymer Materials for Electronics , Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, China |
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| Abstract: | A silicon compound (GAPSO) was synthesized to modify the diglycidyl ether of bisphenol-A (DGEBA). The chemical structure of GAPSO was confirmed using FT-IR, 29Si NMR and GPC. The mechanical and thermal properties and morphologies of the cured epoxy resins were investigated by impact testing, tensile testing, differential scanning calorimetry and environmental scanning electron microscopy. The impact strength and tensile strength were both increased by introducing GAPSO, meanwhile the glass transition temperature (Tg ) was not decreased and the morphologies of the fracture surfaces show that the compatibility of GAPSO with epoxy resin was very good and the toughening follows the pinning and crack tip bifurcation mechanism. The high functional groups in GAPSO can react during the curing process, and chemically participate in the crosslinking network. GAPSO is thus expected to improve the toughness of epoxy resin, meanwhile maintain the glass transition temperature. |
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| Keywords: | Epoxy silicon sol-gel mechanical properties morphology thermal property |
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