| 含裂纹金属薄板胶接补强的应力分析 |
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| 引用本文： | 卫丰,卢智先,陈思懿.含裂纹金属薄板胶接补强的应力分析[J].力学学报,1990,22(4):495-499. |
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| 作者姓名： | 卫丰 卢智先 陈思懿 |
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| 作者单位： | 西北工业大学 |
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| 摘 要： | 本文应用弹塑性有限元分析胶接补强的含裂纹薄板结构,剪切单元被改进使之可连结平面等参单元并用于分析胶层应力。计算了补强后裂纹板的应力强度因子,并将计算结果与实验数据作了比较,分析表明,胶接补强可显著降低裂尖的应力集中,使裂纹板内应力分布趋于均匀。
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| 关 键 词： | 裂纹 金属 薄板 胶接补强 应力 |
STRESS ANALYSIS OF CRACKED, ADHESIVELY BONDED LAMINATED STRUCTURE |
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| Abstract: | Cracked, adhesively bunded laminated structure is analysed by elastic-plastic finite element. 2-D isoparametric element is used to determine stress in crack and adhesively bunded plate, the stress intensity factors obtained are compared with experimental results. Modified shear element is presented and used to analyse shear strain and stress in adhesive. From analysis, the stress in crack plate tends to be uniform when it is adhesively bunded. |
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| Keywords: | adhesively bonded finite element shear element |
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