Surface morphology of Ge‐modified 3C‐SiC/Si films |
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Authors: | Richard Nader Michel Kazan Elie Moussaed Thomas Stauden Merten Niebelschütz Pierre Masri Jörg Pezoldt |
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Affiliation: | 1. Groupe d'Etude des Semi‐Conducteurs, CNRS‐UMR 5650, Université de Montpellier II, CC 074, 34095 Montpellier, Cedex 5, France;2. CICECO, Departamento de Fisica, Universidade de Aveiro, 3810‐193 Aveiro, Portugal;3. FG Nanotechnology, Center of Micro‐ and Nanotechnologies, TU Ilmenau, PF 100565, 98684 Ilmenau, Germany |
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Abstract: | The influence of Ge deposition prior to carbon interaction with 3° off‐axis Si(111) substrates on the structural and morphological properties of the formed silicon carbide (SiC) layer is studied. In situ reflection high‐energy electron diffraction (RHEED) and X‐ray diffraction (XRD) revealed the formation of the cubic silicon carbide (3C‐SiC) modification. In situ spectroscopic ellipsometry measurements revealed a decreasing 3C‐SiC thickness with increasing Ge predeposition. Atomic force microscopy (AFM) studies revealed that the surface overlayer morphology is mainly formed by periodic step arrangements whose relevant geometric parameters, i.e. lateral separation, height and terrace width, depend on the Ge content. Besides the changes of the step morphology, the surface roughness and the grain size and the strain of the formed 3C‐SiC decreases with increasing germanium precoverage. Copyright © 2008 John Wiley & Sons, Ltd. |
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Keywords: | X‐ray diffraction atomic force microscopy molecular beam epitaxy |
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