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Growth and characterization of GaAs layers on polished Ge/Si by selective aspect ratio trapping
Authors:J.Z. Li  J. BaiJ.M. Hydrick  J.S. ParkC. Major  M. CarrollJ.G. Fiorenza  A. Lochtefeld
Affiliation:AmberWave Systems Corporation, 13 Garabedian Drive, Salem, NH 03079, USA
Abstract:
Epitaxial GaAs layers have been deposited on polished Ge film grown on exactly (0 0 1) oriented Si substrate by metal-organic chemical vapor deposition (MOCVD) via aspect ratio trapping (ART) method. Double-crystal X-ray diffraction shows that the full-width at half-maximum (FWHM) of the (4 0 0) reflection obtained from 1 μm GaAs is 140 arcsec. Scanning electron microscopy (SEM) of the GaAs layer surface shows that the amount of antiphase domain defects (APD) raised from GaAs/Ge interface using Ge ART on Si is dramatically reduced compared to GaAs layers grown on exact (0 0 1) Ge substrate. Defect reduction and Ge diffusion at vicinal GaAs/Ge interface were investigated via cross-section transmission electron microscopy (X-TEM) and secondary ion mass spectrometry (SIMS). Film morphology and optical properties were evaluated via SEM and room temperature photoluminescence (PL).
Keywords:81.05.Ea   81.15.Gh   78.55.Cr   71.55.Eq   73.40.Kp
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