Application of Nanoparticles in Polymers for Electronics and Electrical Engineering

Different organophilic layered silicates and a modified hydrotalcite were used as functional nanofillers for thermoplastic and thermosetting polymers. Polyamide 6 (PA6) and poly(butylene terephthalate) silicate nanocomposites were prepared by melt compounding using a twin‐screw extruder. The morphology of the materials was investigated by transmission electron microscopy and small‐angle X‐ray scattering, and was found to be characterized by homogeneous dispersion of high aspect ratio silicate layers in the polymer matrix. The PA6 nanocomposite displayed excellent thermo‐mechanical properties at low filler loadings and improved barrier properties. Epoxy nanocomposites have also been prepared and characterized with regard to their morphology and their water vapor permeability.