贴片云纹干涉法测复合应力强度因子

贴片法把Post提出的云纹干涉法向前推进了一步,它成本低、实验周期短、工艺简单,在一般光测力学实验室都可进行。由于贴片可以分离,使云纹干涉法用于现场测量成为可能。本文提出了估计裂纹尖端绝对位移的切点连线法。编写了可以计算尖端刚性位移和旋转的阻尼最小二乘法程序,应用单向栅线,测定复合应力强度因子,与理论值进行了比较,得到了满意的结果。计算和实验的位移场重合。

Determination of Stress Intensity Factors of Mixed Mode by Moire Interferometry of Sticking Films

The moric interferometry of sticking films make a progress in interferometry method developed by D. Post. The cycle of measuring is shorter than that required by any other optical method. It is simple, convenient and at low cost. It can be carried out in an ordinary optical mechanics lab. Since the film can be removed from measured object, this technique is also possible to be applied in industries. In order to estimate the absolute displacement of the crack tip, a method is suggested to tiack points of tangency. A program is edited to determine rigid body motion of crack tip. By means of unidirectional grating, SIF are measured and contour lines of displacment are drawn. The latter agrees very weel with that obtained theoretically. It implies that the SIF determined hereby are reliable.