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Crack in functionally graded piezoelectric strip bonded to elastic surface layers under electromechanical loading
Authors:S Ueda  
Institution:

Department of Mechanical Engineering, Faculty of Engineering, Osaka Institute of Technology, 5-16-1 Omiya, Asahi-ku, Osaka, Osaka 535-8585, Japan

Abstract:Solved is the problem of a crack in a functionally graded piezoelectric material (FGPM) bonded to two elastic surface layers. It is assumed that the elastic stiffness, piezoelectric constant, and dielectric permittivity of the FGPM vary continuously along the thickness of the strip. The outside layers are under antiplane mechanical loading and in-plane electric loading. The solution involves solving singular integral equations by application of the Gauss–Jacobi integration formula. Numerical calculations are carried out to obtain the energy density factors. Their variations with the geometric, loading and material parameters are shown graphically.
Keywords:Elasticity  Fracture mechanics  Functionally graded piezoelectric strip  Energy density factor  Integral transform
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