Poly(vinylpyrrolidone)‐based films grown on copper surfaces

The influence of molecular weight and the amount of the poly(vinylpyrrolidone) (PVP) on the growth of poly(vinylpyrrolidone)–based films on copper surfaces was studied by electrochemical, infrared and electronic spectroscopy, and thermogravimetric methods. Complex polymer/metal ions were deposited onto a copper surface, as the result of the electrochemically generated reaction of copper cations with PVP and SCN^?, in sulfuric acid media. Spontaneous film growth on copper surfaces was generated and characterized as a Cu(II)/PVP/SCN^? complex. Infrared spectra and thermal gravimetric curves of the films generated at + 0.7 V were compared with the chemically synthesized complex, and show the same patterns. The oxidation process can be described as: Cu(0)→Cu(I) and Cu(I)→Cu(II), and the copper complex formed at more positive potentials was characterized as Cu(II)/PVP/SCN^?, with copper bonded to the oxygen atom of PVP and thiocyanate ligand N‐linked. This study focuses on the complex formation on a copper surface in acid media and its characterization through electrochemical and spontaneously generated reactions. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 2206–2214, 2009