Structural changes and defect development in epoxy adhesive compounds during thermal aging |
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Authors: | A. P. Stasyunas A. N. Machyulis |
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Affiliation: | (1) Kaunas Polytechnic Institute, USSR;(2) Institute of Physicotechnical Problems of Power Engineering, AS Lithuanian SSR, Kaunas |
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Abstract: | ![]() The structural characteristics of epoxy adhesive compounds and the development of surface defects during thermal aging have been investigated. Profilograms of the fracture surfaces of bonded joints have been obtained and certain causes of the increased dispersion of the bond strength characteristics explored.Mekhanika Polimerov, Vol. 4, No. 2, pp. 293–295, 1968 |
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