Investigation of electrochemical reactions in the solid state cell Cu/RbCu4Cl3I2/C |
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Authors: | Gennady I Ostapenko Antony Cox Lidiya A Ostapenko |
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Institution: | (1) Institute of Radio Engineering & Electronics, Russian Academy of Sciences, 48 Goncharov Str., Ulyanovsk 432011, Russia,;(2) Department of Materials Science and Metallurgy, University of Cambridge, Cambridge CB3 3QZ, UK,;(3) Kustanay Agricultural Institute, 28 Abay Str., Kustanay 458015, Kazakhstan, |
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Abstract: | Using experimental potential values for a vitreous carbon electrode in contact with the RbCu4Cl3I2 solid electrolyte, the concentration of Cu2+ ions in the electrolyte was determined. At 0.5 V, the concentration of Cu2+ was 1.25×1018 cm–3. The estimated values of the Cu2+ ion concentration in RbCu4Cl3I2 (0.8%) and the potential of the vitreous carbon electrode after electrochemical decomposition of RbCu4Cl3I2 (0.606 V) correspond to experimental values of 2% and 0.58 V, respectively. This demonstrates the adequacy of the model describing
the electrode potential of Cu2+ as a function of the concentration in RbCu4Cl3I2. When the C/RbCu4Cl3I2 interface was polarized, the diffusion coefficient of Cu2+ was 1.5×10–8 cm2 s–1. Investigations of the interface between the copper electrode and RbCu4Cl3I2 were carried out by galvanostatic and potentiostatic methods. A 1-μm layer of cuprous oxide, Cu2O, was discovered on the interface of the copper electrode with RbCu4Cl3I2. This layer blocks the course of the electrochemical reaction Cu0–e–⇌Cu+ with participation of copper metal. The copper electrode behaves as an inert redox electrode at low overvoltages. In this
case, at the Cu2O/RbCu4Cl3I2 interface an electrochemical reaction with Cu2+ ion participation, Cu+–e–⇌Cu2+, takes place. The results suggest that the reaction rate is limited by slowing the Cu2+ diffusion in RbCu4Cl3I2. The initial Cu2+ ion concentration in the electrolyte near this interface is about 1.4×1017 cm–3. The exchange current density is about (4±2)×10–6 A cm–2. At potentials ϕ>8–10 mV, an electrical breakdown of the Cu2O layer takes place, allowing copper metal to ionize to Cu+. We suggest that at 10 mV<ϕ<100 mV the rate of this reaction is limited by the formation and growth of copper nuclei and
at ϕ>120 mV the reaction rate is limited by charge transfer.
Electronic Publication |
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Keywords: | Solid electrolyte Rubidium copper chloride iodide Inert electrode potential Copper(II) ion concentration Electrode kinetics |
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