电感耦合等离子体原子发射光谱(ICP-AES)法测定锡铅焊料中11种微量元素

根据目前市场上常见锡铅焊料中主元素的特性(锡含量范围0.X%~95%,铅含量范围X%~99%),合理选择了有效的样品前处理方法。参考铸造锡铅焊料牌号及化学成分和仪器工作条件,确定了待测元素的测定范围。应用电感耦合等离子体原子发射光谱法同时测定锡铅焊料中锑、铋、铁、砷、铜、银、锌、铝、镉、磷、金11种元素的含量,方法操作简单。选择了合适的分析谱线,进行了基体元素对待测元素以及各待测元素之间的干扰研究,基体效应小,各待测元素之间基本无干扰,11次独立的测定数据相对标准偏差为1.0%~11.3%,方法的加标回收率为90.2%~105%。完全能满足现实生产中对锡铅焊料杂质元素的测定要求。

Determination of 11 trace elements Content in Tin-lead Solders by Inductively Coupled Plasma-Atomic Emission Spectrometry (ICP-AES)

According to the characteristics of the main elements in the commercial tin-lead solders (tin content range from 0.X% to 95% and lead from X% to 99%), an effective digestion method was used to determine the content of minor elements. The range of the elements was determined by reference to the grade and chemical composition of casting tin-lead solders and the working conditions of the instrument. Inductively coupled plasma-atomic emission spectrometry (ICP-AES) was used to determine the content of eleven elements, such as antimony, bismuth, iron, arsenic, copper, silver, zinc, aluminum, cadmium, phosphorus and gold. The sample was completely dissolved, appropriate analytical spectral lines were selected, and the interference from the matrix and the interference between the determined elements was studied. The matrix effect was small, and almost no interference between the determined elements was observed. The relative standard deviation from eleven independent experiments varies between 1.0% and 11.3%, and the recovery rate varied from 90.2% to 105%. The proposed method completely meets the analysis requirements for the impurity element analysis in tin-lead solders.