Deep SiC etching with RIE

SiC is currently an important topic in power devices. This new technology leads to lower power losses, faster switching, and higher working temperature. The design of SiC power devices requires the integration of edge termination techniques to obtain a high blocking voltage. The mesa structure approach is one well-established method. It could be used alone or in combination with a Junction Termination Extension (JTE). The mesa consists of a structure that removes material around the pn-junction. Due to the strong Si–C bonds, conventional chemical–wet etching solutions are inefficient on SiC, so plasma methods are required to etch SiC.The presented work is based on the use of an RIE reactor with an SF₆/ O₂ plasma. Its geometry structure and parameters were optimized. An etch rate of 0.35 μm/min was obtained without any trenching phenomenon. Trenches deeper than 10 μm deep were realized with a nickel etching mask that shows a high selectivity. AFM analysis revealed an etched surface as smooth as the initial one.