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Network structure and glass transition of epoxy resins cured with active ester
Authors:S Nakamura  M Arima
Institution:1. Department of Applied Chemistry, Faculty of Engineering, Kanagawa University, Kanagawa-Ku, 221, Yokohama, Japan
Abstract:The effect of network structure on the glass transition temperature (T g) was examined by differential scanning calorimetry, thermomechanical analysis and dynamic thermomechanometry for epoxy resins cured with mixtures of curing agents consisting of an active ester, 1,3,5-triacetoxybenzene (TAB), and a polyfunctional phenol, 1,3,5-trihydroxybenzene (THB). Free hydroxyl groups are formed from THB after curing, whereas acetyl groups are left from TAB. TheT g value of cured epoxy resins decreased with increasing TAB content in the curing agent, which is attributed to the looser network structure induced by the steric hindrance of acetyl groups from TAB in the curing reaction and also to the weaker intermolecular interaction and the internal plasticization of acetyl groups from TAB.
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