CMP流场的数值模拟及离心力影响分析

化学机械抛光(chemical mechanical polishing,CMP)是一项融合化学分解和机械力学的工艺, 其中包含了流体动力润滑的作用.在已有润滑方程的基础上, 提出并分析了带有离心力项的润滑方程.利用Chebyshev加速超松弛技术对有离心力项的润滑方程进行求解,得到离心力对抛光液压力分布的影响. 数值模拟结果表明,压力分布与不带离心力项的润滑方程得出的明显不同;无量纲载荷和转矩随中心膜厚、转角、倾角、抛光垫旋转角速度等参数的变化趋势相同,但数值相差较大, 抛光垫旋转角速度越大差别越大. 

HYDRODYNAMIC SIMULATION AND THE EFFECT OF CENTRIFUGAL FORCEFOR CHEMICAL MECHANICAL POLISHING PROCESS

Chemical mechanical polishing process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves hydrodynamic lubrication. In this paper, the modified Reynolds equation with centrifugal force is investigated and solved by means of Chebyshev acceleration method with successive over-relaxation algorithm, to obtain the effects of centrifugal force on the slurry pressure distributions. The numerical results show that it is markedly different for the pressure distribution and the same tendency for dimensionless resultant forces and moments along with standard nominal clearance, rolling angle, pitch angle and pad angular velocity, obtained from the Reynolds equations with and without centrifugal force terms, though the values of dimensionless resultant forces and moments are different, with the significant effect of the pad angular velocity.