Heat-resistant and soluble fluorinated poly(amide imide)s based on non-coplanar ortho-linked diimide-dicarboxylic acid

A series of novel fluorinated heat-resistant poly(amide imide)s (PAIS) based on non-coplanar diimide-diacid monomer (DIDA) were synthesized and characterized. The poly(amide imide)s were obtained in high yields and possessed inherent viscosities in the range of 0.47-0.91 dL g⁻¹. All of the polymers were amorphous in nature, showed outstanding solubility and could be readily soluble in common organic solvents such as N,N-dimethylacetamide, N-methyl-2-pyrrolidinoned, dimethyl sulfoxide, N,N-dimethylformamide, pyridine and tetrahydrofuran. Glass transition temperatures were in the range of 221-263 °C, as determined by differential scanning calorimetry. Degradation temperatures for 10% weight loss occurred all above 520 °C and char yields was more than 50% at 700 °C in nitrogen atmosphere. Moreover, these PAIs possessed low refractive indexes (n = 1.58-1.59), birefringence (Δn = 0.008-0.013), and dielectric constants (? ≈ 2.5) due to the trifluoromethyl pendent groups and ortho-catenated aromatic rings that interrupt chain packing and increase free volume.