Evaluation of the substrate effect on indentation behavior of film/substrate system |
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| Authors: | J.S. Wang X.J. Zheng H. Zheng Z. Zhu S.T. Song |
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| Affiliation: | a Faculty of Materials, Optoelectronics and Physics, Xiangtan University, Xiangtan, Hunan 411105, PR China
b Key Laboratory of Low Dimensional Materials and Application Technology (Xiangtan University), Ministry of Education, Xiangtan, Hunan 411105, PR China |
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| Abstract: | A method to evaluate the substrate effect quantitatively in film indentation is proposed. For the thin film deposited on the substrate, the power function relationship is used to describe the loading curve of the film indentation behavior. The loading curve exponent of the power function which is the fitting parameter can reflect the substrate effect quantitatively. The finite element method is used to simulate the nanoindentation process of the film/substrate system. The loading curve exponent can be obtained from the simulation results. A substrate effect factor based on the loading curve exponent is defined to characterize the effect of the substrate on film indentation. Meanwhile, the dimensionless function of the loading curve exponent related with the material properties and indentation depth is obtained. The results can be helpful to the measurement of the mechanical properties of thin films by means of nanoindentation. |
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| Keywords: | Substrate effect Nanoindentation Finite element method Dimensionless analysis |
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