首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Network structure and thermomechanical properties of hybrid DGEBA networks cured with 1‐methylimidazole and hyperbranched poly(ethyleneimine)s
Authors:Xavier Fernández‐Francos  David Santiago  Francesc Ferrando  Xavier Ramis  Josep M Salla  Àngels Serra  Marco Sangermano
Institution:1. Department of Mechanical Engineering, Universitat Rovira i Virgili, C/Pa?sos Catalans 26, 43007 Tarragona, Spain;2. Thermodynamics Laboratory, ETSEIB, Universitat Politècnica de Catalunya, Av. Diagonal 647, 08028 Barcelona, Spain;3. Department of Analytical and Organic Chemistry, Universitat Rovira i Virgili, C/ Marcel·lí Domingo s/n, 43007 Tarragona, Spain;4. Department of Applied Science and Technology, Politecnico di Torino, Corso Duca Degli Abruzzi 24, 10129 Torino, Italy
Abstract:The use of commercially available hyperbranched poly(ethyleneimine)s (Lupasol?, BASF) as polymeric modifiers in diglycidyl ether of bisphenol A thermosetting formulations using 1‐methylimidazole (MI) as anionic initiator has been studied. Poly(ethyleneimine)s can get incorporated into the network structure by condensation of amine and epoxy groups. The excess, over‐stoichiometric epoxy groups can undergo anionic homopolymerization initiated by MI. The thermal, dynamomechanical, and mechanical properties of the resulting materials have been determined using DSC, thermomechanical analysis (TMA), dynamomechanical analysis (DMA), and mechanical testing. The effect of the different amine modifiers on the MI networks, determined by their structure, is complex. Low initiator content and high molecular weight modifiers create significant mobility restrictions, which have a strong effect on the glass transition temperature and the apparent crosslinking density of the cured materials. © 2012 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2012
Keywords:epoxy thermosets  hyperbranched  impact strength  mechanical properties  network structure  thermal properties  thermomechanical properties  thermosets
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号