Oxidative Conversion of PFC via Plasma Processing with Dielectric Barrier Discharges

Perfluorocompounds (PFCs) have been extensively used as plasma etching andchemical vapor deposition (CVD) gases for semiconductor manufacturingprocesses. PFCs have significant effects on the global warming and havevery long atmospheric lifetimes. Laboratory-scale experiments were performedto evaluate the effectiveness of CF4 conversion by using dielectric barrierdischarges (DBD). The results of this study revealed that the removalefficiency of CF₄ increased with application of higher voltage, gas residence time, oxygen content, and frequency. Combined plasma catalysis(CPC) is an innovative way for abatement of PFC and experimental results indicated that combining plasma with catalysts could effectively remove CF4. Products were analyzed by Fourier transform–infrared spectroscopy (FT–IR) and the major products of the CF4 processing with DBD were CO2, COF2, and CO, when O was included in the discharge process. Preliminary results indicated that as high as 65.9% of CF4 was decomposed with CPC operated at 15 kV, 240 Hz for the gas stream containing 300 ppmv CF₄,20% by volume O₂, and 40% by volume Ar, with N₂ as thecarrier gas.