Thermal expansion of poly(vinylidene fluoride)

The thermal expansion behavior of oriented poly(vinylidene fluoride) films has been studied over the temperature range ?75 to +20°C. Representative high draw, low draw, and voided samples have been examined. For all samples at low temperatures the transverse thermal expansion coefficients, both in the plane of the sheet and perpendicular to it, are similar and have positive values of about 10^?4 K^?1. In the draw direction the thermal expansion coefficients are much smaller in magnitude and can be either positive or negative, the room temperature values varying in the range +4 × 10^?6 K^?1 for low draw samples to ?14 × 10^?6 K^?;1 for high draw samples. As the temperature is raised the coefficients also increase but, above the glass transition temperature, the value in the draw direction, α₁, shows a rapid fall in value. It is shown that this effect can be related quantitatively to the presence of an internal shrinkage stress. Differences between samples can then be primarily related to differences in the magnitude of this internal stress and to differences in the temperature dependence of the modulus of the sample.