| 组件裂尖变形场的云纹显微倍增研究 |
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| 引用本文： | 史训清,戴福隆,刘宝琛.组件裂尖变形场的云纹显微倍增研究[J].力学学报,1997,29(4):448-455. |
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| 作者姓名： | 史训清 戴福隆 刘宝琛 |
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| 作者单位： | 北京航空航天大学动力工程系，100083 |
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| 摘 要： | 将云纹干涉法与显微、倍增技术相结合，发展了一种位移场云纹条纹显微倍增方法．对该方法进行了严格的理论推导和精确的实验验证，并用该方法对热载下微电子模拟组件的层间裂纹尖端位移场和奇异性进行了实验研究
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| 关 键 词： | 显微倍增 云纹法 裂纹尖 变形场 微电子组件 |
STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY |
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| Shi Xunqing.STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY[J].chinese journal of theoretical and applied mechanics,1997,29(4):448-455. |
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| Authors: | Shi Xunqing |
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| Abstract: | A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings. |
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| Keywords: | micro technique multiplication technique reversal technique packaging module singularity |
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