用于线路板检测的高分辨率X射线像增强器的研制

鉴于传统的检测方法无法看到封装后芯片内部的线路虚焊和桥接等问题，而且随着封装的小型化和组装的高密度化以及各种新型封装技术的不断涌现，对于检测装置的分辨率要求越来越高，而高分辨率的X射线检测装置是解决这一问题的关键。提出一种新型高分辨率X射线像增强器，它是线路板检测和芯片封装检测装置中的核心器件之一，其极限分辨率制约着X射线检测装置的发展。通过对其制作工艺的改进和采用新型窗口材料进行真空封接，使其分辨率达到了20lp/mm。

Development of high-resolution X-ray image intensifier for inspection of circuit boards

Because of the traditional inspection system not being able to detect the defects at solder joints and solder bridges in ball grid array (BGA ) as well as the emergence of miniaturized packaging, high-density assembly and various new packaging technologies, a high resolution inspection system is proposed to solve this problem. A new type of high-resolution X-ray image intensifier is introduced. As one of the key devices for circuit board testing and chip packaging detection, its resolution performance has become a bottleneck for the development of X-ray detection system. Its resolution reached 20lp/mm after the improvement of the fabrication process and the use of new window material for vacuum sealing.