| 电解铜箔添加剂研究进展 |
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| 引用本文： | 李俊,张震.电解铜箔添加剂研究进展[J].化学研究,2010,21(6):91-95. |
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| 作者姓名： | 李俊 张震 |
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| 作者单位： | 华南理工大学化学与化工学院,广东省高等学校新能源技术重点实验室,广东广州510640 |
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| 基金项目： | 广东省教育部产学研合作项目，广东省科技计划高新技术产业化项目 |
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| 摘 要： | 介绍了电解铜箔添加剂的研究现状和进展;指出随着信息产业的不断发展,对电子产品印刷电路板(PCB)制作的要求不断提高,而对关键的电解铜箔技术所用的添加剂的要求也日益苛刻.同时就电解铜箔添加剂的发展趋势进行了展望,以期为今后国内电解铜箔行业的发展提供参考.
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| 关 键 词： | 电解铜箔 添加剂 研究进展 |
Research Progress of Additives for Electrolyzing Copper Foil |
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| LI Jun,ZHANG Zhen.Research Progress of Additives for Electrolyzing Copper Foil[J].Chemical Research,2010,21(6):91-95. |
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| Authors: | LI Jun ZHANG Zhen |
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| Institution: | (School of Chemistry and Chemical Engineering,Key Laboratory of New Energy Technology for Guangdong Universities,South China University of Technology,Guangzhou 510640,Guangdong,China) |
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| Abstract: | A review is given about the current status and research progress of additives for electrolyzing copper foil.It is pointed out that with continuous development of information industry,the requirements for printing circuit board（PCB） in electronics are becoming increasingly strict,so are the requirements for the additives used for electrolyzing Cu foil——the key technology of manufacturing PCB.At the same time,perspectives are suggested concerning the development trend of the additives for electrolyzing Cu foil,which,hopefully,is to contribute to the advance of domestic Cu foil electrolysis industry. |
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| Keywords: | electrolyzing copper foil additive research progress |
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