Low dielectric constant polyimide nanomats by electrospinning

The proper combination of material (i.e. fluorinated polyimides) and processing technique (electrospinning) could lead to the formation of polyimides with low dielectric constant, high thermo‐oxidative stability and glass transition temperature, and high hydrophobicity. The polyimides in this work were based on 4, 4‐bis [3′‐trifluoromethyl‐4′ (4′‐amino benzoxy) benzyl] biphenyl (Q) and various fluorinated and non‐fluorinated dianhydrides namely benzene‐1,2,4,5‐tetracarboxylic dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride, and 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA). Processing of the polyimides was carried out in poly(amic acid) stage by two different methods—electrospinning and solution casting for comparison purposes. The processing of polyimides by electrospinning led to enhancement in mechanical properties (dianhydride‐structure dependent) and hydrophobicity without sacrificing thermo‐oxidative stability and glass transition temperatures significantly. Also, low dielectric constants (as low as 1.43) could be attained by suitable combination of dianhydride (6FDA) with 4, 4‐bis [3′‐trifluoromethyl‐4′ (4′‐amino benzoxy) benzyl] biphenyl diamine. Copyright © 2011 John Wiley & Sons, Ltd.