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Glass transitions in crosslinked epoxy networks
Authors:S. Tarifa  A. Bouazizi
Affiliation:(1) Laboratoire de Physico-Chimie des Hauts Polymères, Ecole Nationale Supérieure de Chimie de Toulouse, 118 route de Narbonne, 31077 Toulouse Cedex, France;(2) Département de Physique, Faculté des Sciences de Monastir, Laboratoire de Physique des Semiconducteurs, 5000, Tunisia
Abstract:
Epoxy resins of DGEBA type were thermally cured with diaminodiphenylmethane as crosslinking agent, and then analysed by Differential Scanning calorimetry (DSC) at various heating rates in order to determine the glass transition temperatureTg of the final networks. First it was shown that during cyclingTg is shifted towards higher values up to a maximum or
$$T_{g_infty  }$$
. Such a change is attributed to an increasing extent of cure which develops during the thermal analysis, and also to relaxation processes thermally activated inside the polymeric matrix. Then the dependence of
$$T_{g_infty  }$$
on the heating rateq imposed by the DSC apparatus was presented forq changing from 0.1 to10DaggerC min–1. At heating rates exceeding 3DaggerC min–1 only the classical temperatureTg was detected, but at smallerq values, an additional endothermic transition was revealed, located at higher temperature and linked to a physical aging-like phenomenon, which takes place at low heating rates. The plot of
$$T_{g_infty  }$$
against logq is divided into two quasi-linear parts on each side ofq=3DaggerC min–1. In conclusions, an equation was given to describe the
$$T_{g_infty  }$$
vs. logq function.
Keywords:DSC analysis  epoxy resins  heating rate  glass transition
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