Surface analysis of thermally annealed porous silicon |
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Authors: | M. Banerjee E. Bontempi S. Basu |
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Affiliation: | a IC Design & Fabrication Centre, Department of Electronics & Tele-communication Engineering, Jadavpur University, Kolkata 700032, India b INSTM and Laboratorio di Chimica per le Tecnologie, Università di Brescia, via Branze 38, 25123 Brescia, Italy c Materials Science Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603102, India |
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Abstract: | Quasi-monocrystalline porous silicon (QMPS) has high potential for photovoltaic application for its enhanced optical absorption compared to bulk silicon in the visible range of solar spectrum. In this study, QMPS was formed from low porosity (∼20-30%) porous silicon (PS) produced by electrochemical anodization, and thermal annealing in the temperature range 1050-1100 °C under pure hydrogen ambient for a duration of 30 min. We analyzed the material surface by grazing incidence X-ray diffraction (GIXRD), field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and dynamic secondary ion mass spectroscopy (SIMS) study. The crystallinity was confirmed by GIXRD while FESEM studies revealed that the surface layer is pore free with voids embedded inside the body. AFM studies indicated relatively smooth and uniform surface and the dynamic SIMS study showed the depth profiles of impurities present in the material. |
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Keywords: | Porous silicon Thermal annealing Surface analysis |
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