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Fabrication of Cu-SiC surface composite under ball collisions |
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| Authors: | S Romankov Y HayasakaIV Shchetinin J-M YoonSV Komarov |
| Institution: | a Chonbuk National University, Jeonju, 561-756, Republic of Korea b High-Voltage Electron Microscope Laboratory, Tohoku University, Sendai 980-8577, Japan c Moscow State Institute of Steel and Alloys, 119049, Moscow, Russia d CDC, Nippon Light Metal Co. Ltd., Shizuoka 421-3291, Japan |
| Abstract: | A nano-grained Cu-SiC surface composite was fabricated on a Cu plate precoated with SiC particles at room temperature after 15 min treatment using ball collisions. The composite formation was the result of mechanical mixing of the plasticized Cu and the SiC particles. Ball collisions refined the grains near the surface to the nanometer scale and destroyed the initial rolling texture of the Cu plate. The surface hardness of the composite layer was almost twice that of the initial Cu plate. |
| Keywords: | Surface composites Grain refinement Nanocrystalline materials Ball impacts Copper |
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