Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.