Process of direct copper plating on ABS plastics

The processes of direct copper plating on ABS plastics were investigated by atomic force microscopy (AFM), ultraviolet-visible absorption spectrometry (UV-vis) and X-ray fluorescence spectroscopy (XRF) techniques. The substrates were etched by CrO₃/H₂SO₄ solution containing Pd²⁺ ions, catalyzed by Pd/Sn colloids solution and accelerated in an alkaline solution containing copper ions. The Pd²⁺ ions in etching solution can reduce the surface roughness and enhance the colloids adsorption. The good dispersivity colloids have excellent catalysis and its UV-vis peaks broaden. After acceleration, when the stability of Cu²⁺-complex is relatively low, Sn²⁺ was oxidized by Cu²⁺ in the alkaline solution meanwhile Cu₂O can be formed. The disproportionation reaction of Cu₂O will proceed and metallic copper forms between the Pd particles, so the conductivity of ABS surface increased. The copper particles play an important role in determining the uniformity of the propagation of copper plating. The particles of copper plating layer were uniformity and fine. The atomic concentration and the thickness of copper layer were analyzed by XRF.