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New epoxy thermosets modified with hyperbranched poly(ester-amide) of different molecular weight
Authors:Mireia Morell  Xavier Ramis  Brigitte Voit
Affiliation:a Department of Analytical and Organic Chemistry, University Rovira i Virgili, C/Marcel lí Domingo s/n, 43007 Tarragona, Spain
b Leibniz Institut für Polymerforschung Dresden e.V., Hohe Strasse 6, 01069 Dresden, Germany
c Thermodynamics Laboratory, ETSEIB University Politècnica de Catalunya, C/Av. Diagonal 647, 08028 Barcelona, Spain
d Department of Mechanical Engineering, University Rovira i Virgili, C/Països Catalans 26, 43007 Tarragona, Spain
Abstract:
The influence of hydroxy-functionalized hyperbranched poly(ester-amide) (HBP) of different molecular weight on the curing process of diglycidylether of bisphenol A (DGEBA) was studied using methyltetrahydrophthalic anhydride (MTHPA) as curing agent. By Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) the curing reaction was monitored and the covalent incorporation of the modifier in the matrix was proved. By thermomechanical analysis (TMA) the reduction of the contraction after gelation on changing the HBP proportion was observed. The incorporation of HBP increased the glass transition temperature (Tg) and reduced the overall shrinkage. The modified materials showed a higher thermal degradability than neat DGEBA thermosets allowing reworkability. Thermal expansion coefficient, Young’s modulus, impact strength and microhardness were improved. The water uptake behavior was also evaluated.
Keywords:Epoxy resin   Hyperbranched polymers   Toughness increase   Shrinkage
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