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UV excimer laser drilled high aspect ratio submicron via hole |
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| Authors: | KH Chen Wenhsing Wu Byung Hwan Chu CY Chang Jenshan Lin SJ Pearton DP Norton F Ren |
| Institution: | aDepartment of Chemical Engineering, University of Florida, Gainesville, FL 32611, United States;bDepartment of Electrical and Computer Engineering, University of Florida, Gainesville, FL 32611, United States;cDepartment of Materials Science and Engineering, University of Florida, Gainesville, FL 32611, United States |
| Abstract: | We have demonstrated UV excimer laser drilled a submicron via hole with an entrance diameter of 300 nm inside a via hole with an entrance diameter of 5 μm. The smaller via hole formation was due to the refocusing of the reflected UV light from the tapered side-wall of the bigger via hole and the wave-guide effect of the light trapped inside the smaller via hole. The aspect ration of the smaller vias hole was >200. This method could be used to fabricate microfilters or nanopores. |
| Keywords: | UV excimer laser Laser drill Microfilters Nanopores |
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