From crack deflection to lattice vibrations—macro to atomistic examination of dynamic cleavage fracture

A set of cleavage experiments with strip-shaped single-crystal silicon specimens subjected to three-point bending is reported. The experiments enabled examination of the relationships between the dynamic energy release rate, the velocity, the orientation-dependent cleavage energy, and the cleavage plane of propagation.Dynamic crack propagation experiments show that when a 0 0 1] silicon single crystal is fractured under three-point bending at ‘parallel’ velocity (directly measured at the bottom surface of the specimen) of up to , it prefers to cleave along the vertical (1 1 0) plane, while when the specimen is fractured under the same conditions but at a velocity higher than , it cleaves along the inclined (1 1 1) plane. At intermediate velocities, the crack will deflect from the (1 1 0) plane to the (1 1 1) plane. Crack velocity was determined by the initial notch length. The local (calculated) velocity of deflection between the cleavage planes ranges from , for a crack propagating on the (1 1 0) plane in the direction, to about , for a crack on the (1 1 0) plane, but in the 0 0 1] direction.It is suggested that the cause of the deflection phenomenon is the anisotropic, velocity-dependent cleavage energy, resulted phonon radiation caused by anisotropic, velocity-dependent lattice vibrations. We have studied the effect of material properties and propose selection criteria to explain the deflection phenomenon: the crack will deflect to the plane of least-energy, for which G−Γ_i(V)=max, or to the plane with maximum crack tip velocity, V_i(Γ)=max.